PackageTSSOP
MountingSurface Mount
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Technical Specifications
NXP P89LPC933HDH,518 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
9.8(Max)
Package Width (mm)
4.5(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AE
Data Bus Width
8bit
Instruction Set Architecture
CISC
Device Core
80C51
Program Memory Type
Flash
Number of Programmable I/Os
26
Number of Timers
2
Interface Type
I2C/SPI/UART
ADC Channels
4
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP P89LPC933HDH,518 Datasheet
Download the complete datasheet for NXP P89LPC933HDH,518 to view detailed technical specifications.
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