Automotive Applications Processor, System on Chip (SoC) featuring an ARM1136JF-S core operating at up to 532 MHz. This 32-bit device utilizes 0.09um process technology and offers 128KB RAM and 32KB ROM. The 400-pin MAP-BGA package, measuring 17x17x1.18mm with a 0.8mm pitch, supports surface mounting. Integrated interfaces include CAN, Ethernet (MII, 10/100Mbps), I2C, I2S, SPI, UART, and USB, suitable for automotive infotainment and navigation systems. Operates within a temperature range of -40°C to 85°C.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP PCIMX356BVMB technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Package Description
Molded Array Process Ball Grid Array
Lead Shape
Ball
Pin Count
400
PCB
400
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.18
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.8
Package Material
Plastic
Mounting
Surface Mount
Family Name
i.MX35
Device Core
ARM1136JF-S
Maximum Clock Rate
532MHz
Program Memory Type
ROM
Data Bus Width
32bit
Maximum Speed
532MHz
Program Memory Size
32KB
Process Technology
0.09um
RAM Size
128KB
Type
Applications Processor
Processing Unit
Microprocessor
Max Operating Supply Voltage
1.47V
Application
Automotive Infotainment/Navigation
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Interface Type
CAN/Ethernet/I2C/I2S/SPI/UART/USB
SPI
2
I2C
3
I2S
2
UART
2
USB
2
USART
0
CAN
2
Ethernet
1
Number of Timers
1
Programmability
Yes
Core Architecture
ARM
Ethernet Interface Type
MII
Ethernet Speed
10Mbps/100Mbps
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
5A002
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PCIMX356BVMB Datasheet
Download the complete datasheet for NXP PCIMX356BVMB to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.