32-bit ARM Cortex M4 RISC microcontroller featuring a 100 MHz maximum clock rate and 512KB of Flash program memory. This surface-mount device offers 128KB of RAM, 90 programmable I/Os, and 14 timers. Connectivity includes 2x CAN, 2x I2C, 3x SPI, 5x UART, and 1x I2S interfaces. The 121-pin MAP-BGA package measures 8x8mm with a 0.65mm pin pitch and supports operating voltages from 1.8V to 3.6V, operating within a temperature range of -40°C to 105°C. Dual ADCs and dual 12-bit DACs are also integrated.
NXP PK10DN512ZVMC10 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Package Description | Molded Array Process Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 121 |
| PCB | 121 |
| Package Length (mm) | 8 |
| Package Width (mm) | 8 |
| Package Height (mm) | 1.27(Max) |
| Seated Plane Height (mm) | 1.52(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | K10 |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Maximum Clock Rate | 100MHz |
| Maximum CPU Frequency | 100MHz |
| Device Core | ARM Cortex M4 |
| Program Memory Type | Flash |
| Program Memory Size | 512KB |
| RAM Size | 128KB |
| Number of Programmable I/Os | 90 |
| Core Architecture | ARM |
| Programmability | Yes |
| Number of Timers | 14 |
| Interface Type | CAN/I2C/I2S/SPI/UART |
| CAN | 2 |
| I2C | 2 |
| SPI | 3 |
| Ethernet | 0 |
| UART | 5 |
| USART | 0 |
| USB | 0 |
| I2S | 1 |
| Max Operating Supply Voltage | 3.6V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 105°C |
| Number of ADCs | Dual |
| DAC Resolution | 12bit |
| Number of DACs | Dual |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Download the complete datasheet for NXP PK10DN512ZVMC10 to view detailed technical specifications.
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