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Technical Specifications
NXP PMBFJ620/A2,115 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
TSSOP
Package Description
Thin Shrink Small Outline Package
Lead Shape
Gull-wing
Pin Count
6
PCB
6
Package Length (mm)
2.2(Max)
Package Width (mm)
1.35(Max)
Package Height (mm)
1(Max)
Seated Plane Height (mm)
1.1(Max)
Pin Pitch (mm)
0.65
Package Material
Plastic
Mounting
Surface Mount
Channel Type
N
Configuration
Dual
Maximum Drain Source Voltage
25V
Maximum Gate Source Voltage
-25V
Maximum Power Dissipation
190mW
Min Operating Temperature
-65°C
Max Operating Temperature
150°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PMBFJ620/A2,115 Datasheet
Download the complete datasheet for NXP PMBFJ620/A2,115 to view detailed technical specifications.
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