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Technical Specifications
NXP PMG370XN,115 technical specifications.
General
| Package/Case | TSSOP |
| Continuous Drain Current (ID) | 960mA |
| Drain to Source Breakdown Voltage | 30V |
| Drain to Source Resistance | 440mR |
| Drain to Source Voltage (Vdss) | 30V |
| Fall Time | 9.5ns |
| Gate to Source Voltage (Vgs) | 12V |
| Input Capacitance | 37pF |
| Lead Free | Lead Free |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -55°C |
| Max Power Dissipation | 690mW |
| Mount | Surface Mount |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Polarity | N-CHANNEL |
| Power Dissipation | 690mW |
| Radiation Hardening | No |
| Rds On Max | 440mR |
| RoHS Compliant | Yes |
| Series | TrenchMOS™ |
| Turn-Off Delay Time | 14ns |
| Turn-On Delay Time | 6.5ns |
Compliance
| RoHS | Compliant |
Datasheet
NXP PMG370XN,115 Datasheet
Download the complete datasheet for NXP PMG370XN,115 to view detailed technical specifications.
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