PackageBGA
MountingSurface Mount
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Technical Specifications
NXP PNX9520E/N1,557 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
BGA
Package Description
Plastic Ball Grid Array
Lead Shape
Ball
Pin Count
456
PCB
456
Package Length (mm)
27
Package Width (mm)
27
Package Height (mm)
1.75
Seated Plane Height (mm)
2.25
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-034
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP PNX9520E/N1,557 Datasheet
Download the complete datasheet for NXP PNX9520E/N1,557 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.