
1-Channel Ethernet PHY, 81-pin LFBGA surface mount component supporting data rates up to 2.5Gbps. Features integrated Clock Data Recovery (CDR) and JTAG support (IEEE 1149.1). Operates with analog and digital power supplies, with typical voltages including 1.2V, 1.25V, 2.5V, and 3.3V. Package dimensions are 9.1mm x 9.1mm x 1.2mm (Max). Operating temperature range is 0°C to 70°C.
NXP PX1011A-EL1:557 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | LFBGA |
| Package Description | Low Profile Fine Pitch Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 81 |
| PCB | 81 |
| Package Length (mm) | 9.1(Max) |
| Package Width (mm) | 9.1(Max) |
| Package Height (mm) | 1.2(Max) |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Number of Channels per Chip | 1 |
| Maximum Data Rate | 2.5Gbps |
| PHY Line Side Interface | No |
| JTAG Support | Yes |
| Standard Supported | IEEE 1149.1 |
| Integrated CDR | Yes |
| Power Supply Type | Analog|Digital |
| Min Operating Supply Voltage | 1.15|1.2V |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Overhead Octet Support | No |
| Max Operating Supply Voltage | 1.25|3.6V |
| Maximum Supply Current | 25mA |
| Typical Operating Supply Voltage | 1.2|1.25|2.5|3.3V |
| Cage Code | H1R01 |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2002/95/EC |
Download the complete datasheet for NXP PX1011A-EL1:557 to view detailed technical specifications.
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