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Technical Specifications
NXP PZU3.0DB2,115 technical specifications.
General
Package/Case
TSSOP
Impedance
95R
Max Operating Temperature
150°C
Min Operating Temperature
-55°C
Max Power Dissipation
250mW
Max Reverse Leakage Current
10uA
Mount
Surface Mount
Package Quantity
3000
Packaging
Tape and Reel
Power Dissipation
275mW
Radiation Hardening
No
RoHS Compliant
Yes
Tolerance
2%
Voltage Tolerance
2%
Zener Voltage
3.075V
Compliance
RoHS
Compliant
Datasheet
NXP PZU3.0DB2,115 Datasheet
Download the complete datasheet for NXP PZU3.0DB2,115 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.