PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP S9S08DZ60F1CLH technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
I2C, SPI, CAN, LIN, SCI
Lead Free
Lead Free
Max Operating Temperature
85°C
Memory Size
60KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Mount
Surface Mount
Number of I/Os
53
Number of Timers/Counters
2
Operating Supply Voltage
5.5V
Oscillator Type
External
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD, I2C
RAM Size
4KB
RoHS Compliant
Yes
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP S9S08DZ60F1CLH Datasheet
Download the complete datasheet for NXP S9S08DZ60F1CLH to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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