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Technical Specifications
NXP S9S08DZ60F2VLC technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Halogen Free
Halogen Free
Interface
I2C, SPI, CAN, LIN, SCI
Max Frequency
40MHz
Max Operating Temperature
105°C
Memory Size
60KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Number of I/Os
25
Operating Supply Voltage
5.5V
Oscillator Type
External
Package Quantity
1250
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
Series
S08
Compliance
RoHS
Compliant
Datasheet
NXP S9S08DZ60F2VLC Datasheet
Download the complete datasheet for NXP S9S08DZ60F2VLC to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.