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Technical Specifications
NXP S9S08DZ96F2CLH technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Interface
I2C, SPI, CAN, SCI, LIN
Max Frequency
40MHz
Max Operating Temperature
85°C
Max Supply Voltage
5.5V
Memory Size
96KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Min Supply Voltage
2.7V
Number of I/Os
53
Number of Programmable I/O
53
Number of Timers/Counters
2
Oscillator Type
External
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
Radiation Hardening
No
RAM Size
4KB
Series
S08
Compliance
RoHS
Not CompliantNo
Datasheet
NXP S9S08DZ96F2CLH Datasheet
Download the complete datasheet for NXP S9S08DZ96F2CLH to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.