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Technical Specifications
NXP S9S08DZ96F2MLH technical specifications.
General
Package/Case
LQFP
Core Architecture
S08
Data Bus Width
8b
Frequency
40MHz
Interface
SPI, SCI, I2C, CAN, LIN
Max Frequency
40MHz
Max Operating Temperature
125°C
Max Supply Voltage
5.5V
Memory Size
96KB
Memory Type
FLASH,
Min Operating Temperature
-40°C
Min Supply Voltage
2.7V
Mount
Surface Mount
Number of I/Os
53
Number of Programmable I/O
87
Oscillator Type
External
Packaging
Tray
Peripherals
POR, PWM, WDT, LVD
Radiation Hardening
No
RAM Size
6KB
Series
S08
Watchdog Timer
Yes
Compliance
RoHS
Compliant
Datasheet
NXP S9S08DZ96F2MLH Datasheet
Download the complete datasheet for NXP S9S08DZ96F2MLH to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.