8-bit CISC microcontroller featuring 8KB Flash program memory and 512B RAM. Operates at a maximum clock rate of 40 MHz with an S08 core architecture. Offers 16 ADC channels and supports I2C, SCI, and SPI interfaces. Packaged in a 28-pin TSSOP (Thin Shrink Small Outline Package) for surface mounting, with dimensions of 9.8mm x 4.5mm x 1.05mm. Suitable for automotive applications with an operating temperature range of -40°C to 105°C.
PackageTSSOP
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP S9S08SL8F1VTLR technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 9.8(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 1.05(Max) |
| Seated Plane Height (mm) | 1.2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Weight (g) | 0.11495 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AE |
| Family Name | S08 |
| Data Bus Width | 8bit |
| Instruction Set Architecture | CISC |
| Maximum Clock Rate | 40MHz |
| Maximum CPU Frequency | 40MHz |
| Device Core | S08 |
| Program Memory Type | Flash |
| Program Memory Size | 8KB |
| RAM Size | 512B |
| Number of Programmable I/Os | 22 |
| Core Architecture | S08 |
| Programmability | Yes |
| Interface Type | I2C/SCI/SPI |
| CAN | 0 |
| I2C | 1 |
| SPI | 1 |
| Ethernet | 0 |
| UART | 0 |
| USART | 0 |
| USB | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 105°C |
| ADC Channels | 16 |
| Number of ADCs | Single |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | EAR99 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP S9S08SL8F1VTLR Datasheet
Download the complete datasheet for NXP S9S08SL8F1VTLR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.