16-bit CISC microcontroller featuring a 64KB Flash program memory and 4KB RAM. This surface-mount device utilizes a 100-pin LQFP package with a 0.5mm pin pitch, measuring 14x14x1.5mm. Operating up to 32 MHz, it supports CAN, I2C, and SPI interfaces, with 80 programmable I/Os and 8 ADC channels. Designed for automotive applications, it functions within a -40°C to 105°C temperature range and a maximum operating supply voltage of 5.5V.
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP S9S12HY64J0VLL technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
100
PCB
100
Package Length (mm)
14
Package Width (mm)
14
Package Height (mm)
1.5(Max)
Seated Plane Height (mm)
1.7(Max)
Pin Pitch (mm)
0.5
Package Weight (g)
0.6852
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-153AB
Family Name
HCS12
Data Bus Width
16bit
Instruction Set Architecture
CISC
Maximum Clock Rate
32MHz
Maximum CPU Frequency
32MHz
Device Core
HCS12
Program Memory Type
Flash
Program Memory Size
64KB
RAM Size
4KB
Number of Programmable I/Os
80
Core Architecture
S12
Programmability
Yes
Number of Timers
2
Interface Type
CAN/I2C/SCI/SPI
CAN
1
I2C
1
SPI
1
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
ADC Channels
8
Number of ADCs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP S9S12HY64J0VLL Datasheet
Download the complete datasheet for NXP S9S12HY64J0VLL to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.