16-bit CISC microcontroller featuring a 256KB Flash program memory and 12KB RAM. This HCS12X core device operates at a maximum clock rate of 40 MHz and offers 91 programmable I/Os. Connectivity includes CAN and SPI interfaces. Packaged in a 112-pin LQFP (20x20mm, 0.65mm pitch) for surface mounting, it supports a maximum operating supply voltage of 5.5V and operates within a temperature range of -40°C to 85°C, with 16 ADC channels.
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP S9S12XS256J0CALR technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
112
PCB
112
Package Length (mm)
20
Package Width (mm)
20
Package Height (mm)
1.45(Max)
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.65
Package Weight (g)
1.2783
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BFA
Family Name
HCS12
Data Bus Width
16bit
Instruction Set Architecture
CISC
Maximum Clock Rate
40MHz
Maximum CPU Frequency
40MHz
Device Core
HCS12X
Program Memory Type
Flash
Program Memory Size
256KB
RAM Size
12KB
Number of Programmable I/Os
91
Core Architecture
S12
Programmability
Yes
Number of Timers
12
Interface Type
CAN/SCI/SPI
CAN
1
I2C
0
SPI
1
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
ADC Channels
16
Number of ADCs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991.a.2
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP S9S12XS256J0CALR Datasheet
Download the complete datasheet for NXP S9S12XS256J0CALR to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.