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Technical Specifications
NXP SA571F technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
CDIP
Package Description
Ceramic Dual In Line Package
Lead Shape
Through Hole
Pin Count
16
PCB
16
Package Length (mm)
19.94(Max)
Package Width (mm)
7.77(Max)
Seated Plane Height (mm)
5.08(Max)
Pin Pitch (mm)
2.54
Package Material
Ceramic
Mounting
Through Hole
Compliance
Cage Code
H1R01
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU
Datasheet
NXP SA571F Datasheet
Download the complete datasheet for NXP SA571F to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.