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Technical Specifications
NXP SA5778D/CE1804 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
18.1(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.45(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013
Category
Serial Triple Gauge Driver
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
Compliance
Cage Code
H1R01
EU RoHS
Yes
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SA5778D/CE1804 Datasheet
Download the complete datasheet for NXP SA5778D/CE1804 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.