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Technical Specifications
NXP SA616BS,115 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | HVQFN EP |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 4.1(Max) |
| Package Width (mm) | 4.1(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Maximum Input Frequency | 150(Typ)MHz |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Min Operating Supply Voltage | 2.7V |
| Typical Operating Supply Voltage | 3V |
| Max Operating Supply Voltage | 7V |
| Maximum Conversion Gain | 17(Typ)dB |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP SA616BS,115 Datasheet
Download the complete datasheet for NXP SA616BS,115 to view detailed technical specifications.
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