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Technical Specifications
NXP SA616BS,115 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
20
PCB
20
Package Length (mm)
4.1(Max)
Package Width (mm)
4.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Maximum Input Frequency
150(Typ)MHz
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Min Operating Supply Voltage
2.7V
Typical Operating Supply Voltage
3V
Max Operating Supply Voltage
7V
Maximum Conversion Gain
17(Typ)dB
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SA616BS,115 Datasheet
Download the complete datasheet for NXP SA616BS,115 to view detailed technical specifications.
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