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Technical Specifications
NXP SA647DH,118 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 6.6(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153AC |
| Category | Receiver |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Maximum RF Operating Frequency Range | 100 to 500MHz |
| Maximum RF Operating Frequency | 200MHz |
| Min Operating Supply Voltage | 2.7V |
| Max Operating Supply Voltage | 5.5V |
| Typical Operating Supply Voltage | 3.3V|5V |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP SA647DH,118 Datasheet
Download the complete datasheet for NXP SA647DH,118 to view detailed technical specifications.
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