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Technical Specifications
NXP SAA5553PS technical specifications.
General
Package Family Name
DIP
Package/Case
SDIP
Package Description
Skinny Dual In Line Package
Lead Shape
Through Hole
Pin Count
52
PCB
52
Package Length (mm)
47.9(Max)
Package Width (mm)
14(Max)
Package Height (mm)
4(Max)
Seated Plane Height (mm)
5.08(Max)
Mounting
Through Hole
Family Name
SAA55xx
Data Bus Width
8bit
Instruction Set Architecture
CISC
Maximum CPU Frequency
12MHz
Device Core
80C51
Program Memory Type
ROM
Program Memory Size
64KB
Core Architecture
8051
Programmability
Yes
Compliance
Cage Code
H1R01
HTS Code
8542310001
Schedule B
8542310000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP SAA5553PS Datasheet
Download the complete datasheet for NXP SAA5553PS to view detailed technical specifications.
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