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Technical Specifications
NXP SAF1508BET technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
36
PCB
36
Package Length (mm)
3.6(Max)
Package Width (mm)
3.6(Max)
Package Height (mm)
0.9(Max)
Seated Plane Height (mm)
1.15(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
RoHS Versions
2002/95/EC
Datasheet
NXP SAF1508BET Datasheet
Download the complete datasheet for NXP SAF1508BET to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.