Dual-channel UART with 128-byte transmit and receive FIFOs, supporting RS-485. Features a maximum data rate of 5Mbps and operates at 2.5V or 3.3V. Housed in a 32-pin HVQFN EP package with thermal enhancement and an exposed pad, measuring 5.1mm x 5.1mm x 0.95mm. Surface-mount component with a 0.5mm pin pitch, suitable for operation between -40°C and 85°C.
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NXP SC16C852IBS technical specifications.
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | HVQFN EP |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 5.1(Max) |
| Package Width (mm) | 5.1(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220 |
| Receive FIFO | 128byte |
| Number of Channels per Chip | 2 |
| Transmit FIFO | 128byte |
| Maximum Data Rate | 5Mbps |
| Transmitter and Receiver FIFO Counter | Yes |
| Standard Supported | RS-485 |
| Maximum Supply Current | 2mA |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Typical Operating Supply Voltage | 2.5|3.3V |
| Maximum Power Dissipation | 500mW |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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