Dual-channel UART with 128-byte transmit and receive FIFOs, supporting RS-485. Features a maximum data rate of 5Mbps and operates at 2.5V or 3.3V. Housed in a 32-pin HVQFN EP package with thermal enhancement and an exposed pad, measuring 5.1mm x 5.1mm x 0.95mm. Surface-mount component with a 0.5mm pin pitch, suitable for operation between -40°C and 85°C.
PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
NXP SC16C852IBS technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
32
PCB
32
Package Length (mm)
5.1(Max)
Package Width (mm)
5.1(Max)
Package Height (mm)
0.95(Max)
Seated Plane Height (mm)
1(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220
Receive FIFO
128byte
Number of Channels per Chip
2
Transmit FIFO
128byte
Maximum Data Rate
5Mbps
Transmitter and Receiver FIFO Counter
Yes
Standard Supported
RS-485
Maximum Supply Current
2mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Typical Operating Supply Voltage
2.5|3.3V
Maximum Power Dissipation
500mW
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SC16C852IBS Datasheet
Download the complete datasheet for NXP SC16C852IBS to view detailed technical specifications.
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