Quick Jump:
Technical Specifications
NXP SC68376BGCAB25 technical specifications.
General
| Package/Case | BQFP |
| Data Bus Width | 32b |
| Interface | SPI, CAN, SCI, EBI/EMI |
| Max Operating Temperature | 85°C |
| Memory Type | ROMless, |
| Min Operating Temperature | -40°C |
| Number of I/Os | 18 |
| Oscillator Type | External |
| Package Quantity | 120 |
| Packaging | Tray |
| Peripherals | POR, PWM, WDT |
| Radiation Hardening | No |
| Series | M683xx |
| Weight | 0.196363oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP SC68376BGCAB25 Datasheet
Download the complete datasheet for NXP SC68376BGCAB25 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
Product Images
