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Technical Specifications
NXP SC68376BGCAB25 technical specifications.
General
Package/Case
BQFP
Data Bus Width
32b
Interface
SPI, CAN, SCI, EBI/EMI
Max Operating Temperature
85°C
Memory Type
ROMless,
Min Operating Temperature
-40°C
Number of I/Os
18
Oscillator Type
External
Package Quantity
120
Packaging
Tray
Peripherals
POR, PWM, WDT
Radiation Hardening
No
Series
M683xx
Weight
0.196363oz
Compliance
RoHS
Compliant
Datasheet
NXP SC68376BGCAB25 Datasheet
Download the complete datasheet for NXP SC68376BGCAB25 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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