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Technical Specifications
NXP SC68376BGMAB20 technical specifications.
General
Package/Case
BQFP
Data Bus Width
32b
Interface
SPI, CAN, SCI, EBI/EMI
Lead Free
Lead Free
Max Operating Temperature
125°C
Memory Type
ROMless, , ROM
Min Operating Temperature
-40°C
Number of I/Os
18
Operating Supply Voltage
5.25V
Oscillator Type
External
Package Quantity
120
Packaging
Tray
Peripherals
POR, PWM, WDT
Radiation Hardening
No
RAM Size
7.5KB
RoHS Compliant
Yes
Series
M683xx
Weight
0.196363oz
Compliance
RoHS
Compliant
Datasheet
NXP SC68376BGMAB20 Datasheet
Download the complete datasheet for NXP SC68376BGMAB20 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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