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Technical Specifications
NXP SC68376BGMAB20 technical specifications.
General
| Package/Case | BQFP |
| Data Bus Width | 32b |
| Interface | SPI, CAN, SCI, EBI/EMI |
| Lead Free | Lead Free |
| Max Operating Temperature | 125°C |
| Memory Type | ROMless, , ROM |
| Min Operating Temperature | -40°C |
| Number of I/Os | 18 |
| Operating Supply Voltage | 5.25V |
| Oscillator Type | External |
| Package Quantity | 120 |
| Packaging | Tray |
| Peripherals | POR, PWM, WDT |
| Radiation Hardening | No |
| RAM Size | 7.5KB |
| RoHS Compliant | Yes |
| Series | M683xx |
| Weight | 0.196363oz |
Compliance
| RoHS | Compliant |
Datasheet
NXP SC68376BGMAB20 Datasheet
Download the complete datasheet for NXP SC68376BGMAB20 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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