PackageHWSON EP
MountingSurface Mount
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Technical Specifications
NXP SE97BTP technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package/Case
HWSON EP
Lead Shape
No Lead
Pin Count
8
PCB
8
Package Length (mm)
2
Package Width (mm)
3
Package Height (mm)
0.73
Seated Plane Height (mm)
0.75
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-229
Interface Type
Serial (2-Wire, I2C, SMBus)
Function
Temp Sensor
Resolution
11bit
Max Operating Supply Voltage
3.6V
Accuracy
±2°C
Output Type
Digital
Min Operating Temperature
-55°C
Max Operating Temperature
125°C
Min Operating Supply Voltage
3V
Typical Operating Supply Voltage
3.3V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SE97BTP Datasheet
Download the complete datasheet for NXP SE97BTP to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.