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Technical Specifications
NXP SI2302DS215 technical specifications.
General
| Package/Case | SOT |
| Continuous Drain Current (ID) | 2.5A |
| Drain to Source Voltage (Vdss) | 20V |
| Fall Time | 34ns |
| Gate to Source Voltage (Vgs) | 8V |
| Input Capacitance | 230pF |
| Lead Free | Lead Free |
| Max Dual Supply Voltage | 20V |
| Max Operating Temperature | 150°C |
| Min Operating Temperature | -65°C |
| Max Power Dissipation | 830mW |
| Number of Elements | 1 |
| Package Quantity | 3000 |
| Packaging | Tape and Reel |
| Power Dissipation | 830mW |
| Radiation Hardening | No |
| Rds On Max | 85mR |
| Reach SVHC Compliant | No |
| Series | TrenchMOS™ |
| Threshold Voltage | 650mV |
| Turn-Off Delay Time | 50ns |
| Turn-On Delay Time | 12ns |
Compliance
| RoHS | Compliant |
Datasheet
NXP SI2302DS215 Datasheet
Download the complete datasheet for NXP SI2302DS215 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.
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