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Technical Specifications
NXP SI9410DY,518 technical specifications.
General
| Package/Case | SOIC |
| Drain to Source Voltage (Vdss) | 30V |
| Max Power Dissipation | 2.5W |
| Mount | Surface Mount |
| Package Quantity | 2500 |
| Packaging | Tape and Reel |
| Rds On Max | 30mR |
| RoHS Compliant | Yes |
| Series | TrenchMOS™ |
Compliance
| RoHS | Compliant |
Datasheet
NXP SI9410DY,518 Datasheet
Download the complete datasheet for NXP SI9410DY,518 to view detailed technical specifications.
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