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Technical Specifications
NXP SPAKXC309AG100A technical specifications.
General
| Package/Case | LQFP |
| Data Bus Width | 24b |
| Frequency | 100MHz |
| Interface | SCI |
| Lead Free | Lead Free |
| Max Frequency | 100MHz |
| Max Operating Temperature | 105°C |
| Min Operating Temperature | -40°C |
| Mount | Surface Mount |
| Number of Bits | 24 |
| Operating Supply Voltage | 3.3V |
| Package Quantity | 2 |
| Packaging | Bulk |
| Radiation Hardening | No |
| RAM Size | 102KB |
| Series | DSP563xx |
| Weight | 0.04653oz |
Compliance
| RoHS | Not CompliantNo |
Datasheet
NXP SPAKXC309AG100A Datasheet
Download the complete datasheet for NXP SPAKXC309AG100A to view detailed technical specifications.
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