32-bit RISC microcontroller featuring an e200 core and 1.5MB of Flash program memory. This surface-mount device offers 80KB of RAM, operates at a maximum clock rate of 16 MHz, and supports multiple interfaces including CAN (6 channels), I2C (1 channel), and SPI (4 channels). Housed in a 208-pin MAP-BGA package with a 1mm pin pitch, it operates from 3.3V/5V and has a wide temperature range of -40°C to 125°C. Additional features include 40 ADC channels and 8 timers, making it suitable for automotive applications.
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NXP SPC5516EACMG66 technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Lead Shape | Ball |
| Pin Count | 208 |
| PCB | 208 |
| Package Length (mm) | 17 |
| Package Width (mm) | 17 |
| Package Height (mm) | 1.3(Max) |
| Seated Plane Height (mm) | 2(Max) |
| Pin Pitch (mm) | 1 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | MPC55xx |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Maximum Clock Rate | 16MHz |
| Maximum CPU Frequency | 16MHz |
| Device Core | e200 |
| Program Memory Type | Flash |
| Program Memory Size | 1.5MB |
| RAM Size | 80KB |
| Core Architecture | e200 |
| Programmability | Yes |
| Number of Timers | 8 |
| Interface Type | CAN/I2C/SCI/SPI |
| CAN | 6 |
| I2C | 1 |
| SPI | 4 |
| Ethernet | 0 |
| UART | 0 |
| USART | 0 |
| USB | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 5.25|5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| ADC Channels | 40 |
| Number of ADCs | Single |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991 |
| Automotive | Yes |
| AEC Qualified | Yes |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
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