32-bit RISC microcontroller featuring an e200 core and 1.5MB of Flash program memory. This surface-mount device offers 80KB of RAM, operates at a maximum clock rate of 16 MHz, and supports multiple interfaces including CAN (6 channels), I2C (1 channel), and SPI (4 channels). Housed in a 208-pin MAP-BGA package with a 1mm pin pitch, it operates from 3.3V/5V and has a wide temperature range of -40°C to 125°C. Additional features include 40 ADC channels and 8 timers, making it suitable for automotive applications.
PackageMAP-BGA
MountingSurface Mount
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Technical Specifications
NXP SPC5516EACMG66 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
MAP-BGA
Lead Shape
Ball
Pin Count
208
PCB
208
Package Length (mm)
17
Package Width (mm)
17
Package Height (mm)
1.3(Max)
Seated Plane Height (mm)
2(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Family Name
MPC55xx
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
16MHz
Maximum CPU Frequency
16MHz
Device Core
e200
Program Memory Type
Flash
Program Memory Size
1.5MB
RAM Size
80KB
Core Architecture
e200
Programmability
Yes
Number of Timers
8
Interface Type
CAN/I2C/SCI/SPI
CAN
6
I2C
1
SPI
4
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
5.25|5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
125°C
ADC Channels
40
Number of ADCs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SPC5516EACMG66 Datasheet
Download the complete datasheet for NXP SPC5516EACMG66 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.