32-bit RISC microcontroller featuring an e200 core and 1.5MB of Flash program memory. This surface-mount device offers 80KB of RAM, a maximum clock rate of 16 MHz, and supports CAN, I2C, SCI, and SPI interfaces. It includes 6 CAN modules, 1 I2C module, and 4 SPI modules, along with 40 ADC channels from a single ADC. Packaged in a 144-pin LQFP (Low Profile Quad Flat Package) with a 0.5mm pin pitch, it operates from 3.3V to 5.5V and is rated for automotive applications within a -40°C to 105°C temperature range.
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP SPC5517EBVLQ48 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
144
PCB
144
Package Length (mm)
20
Package Width (mm)
20
Package Height (mm)
1.45(Max)
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Weight (g)
1.3191
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BFB
Family Name
MPC55xx
Data Bus Width
32bit
Instruction Set Architecture
RISC
Maximum Clock Rate
16MHz
Maximum CPU Frequency
16MHz
Device Core
e200
Program Memory Type
Flash
Program Memory Size
1.5MB
RAM Size
80KB
Core Architecture
e200
Programmability
Yes
Number of Timers
8
Interface Type
CAN/I2C/SCI/SPI
CAN
6
I2C
1
SPI
4
Ethernet
0
UART
0
USART
0
USB
0
I2S
0
Max Operating Supply Voltage
5.25|5.5V
Min Operating Temperature
-40°C
Max Operating Temperature
105°C
ADC Channels
40
Number of ADCs
Single
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
3A991
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SPC5517EBVLQ48 Datasheet
Download the complete datasheet for NXP SPC5517EBVLQ48 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.