32-bit RISC microcontroller featuring an e200z7d core, operating at up to 150 MHz. This MCU offers 1MB of Flash program memory and 256KB of RAM. It supports automotive applications with multiple CAN interfaces (4), Ethernet (1), I2C (2), and SPI (2). Packaged in a 473-pin MAP-BGA (19x19x1.18mm) for surface mounting, it operates from 3.3V to 5.5V and across a temperature range of -40°C to 125°C, including 34 ADC channels.
PackageMAP-BGA
MountingSurface Mount
Quick Jump:
Technical Specifications
NXP SPC5673KFF0MMS1R technical specifications.
General
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Package Description | Molded Array Process Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 473 |
| PCB | 473 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.18 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Weight (g) | 1.6233 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | MPC56xx |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Maximum Clock Rate | 150MHz |
| Maximum CPU Frequency | 150MHz |
| Device Core | e200z7d |
| Program Memory Type | Flash |
| Program Memory Size | 1MB |
| RAM Size | 256KB |
| Number of Programmable I/Os | 16 |
| Core Architecture | e200 |
| Programmability | Yes |
| Number of Timers | 5 |
| Interface Type | CAN/Ethernet/I2C/SCI/SPI |
| CAN | 4 |
| I2C | 2 |
| SPI | 2 |
| Ethernet | 1 |
| UART | 0 |
| USART | 0 |
| USB | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 3.6|5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| ADC Channels | 34/34/34/34 |
| Number of ADCs | Quad |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991 |
| Automotive | Yes |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP SPC5673KFF0MMS1R Datasheet
Download the complete datasheet for NXP SPC5673KFF0MMS1R to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.