32-bit RISC microcontroller featuring an e200z7d core, operating at up to 180 MHz. This MCU offers 2MB of Flash program memory and 512KB of RAM. It supports automotive applications with 4 CAN, 1 Ethernet, 3 I2C, and 3 SPI interfaces. Packaged in a 473-pin MAP-BGA (19x19x1.18mm) for surface mounting, it operates from 3.3V/5V and across an extended temperature range of -40°C to 125°C.
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NXP SPC5675KFF0MMS2R technical specifications.
| Basic Package Type | Ball Grid Array |
| Package Family Name | BGA |
| Package/Case | MAP-BGA |
| Package Description | Molded Array Process Ball Grid Array |
| Lead Shape | Ball |
| Pin Count | 473 |
| PCB | 473 |
| Package Length (mm) | 19 |
| Package Width (mm) | 19 |
| Package Height (mm) | 1.18 |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.8 |
| Package Weight (g) | 1.6233 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Family Name | MPC56xx |
| Data Bus Width | 32bit |
| Instruction Set Architecture | RISC |
| Maximum Clock Rate | 180MHz |
| Maximum CPU Frequency | 180MHz |
| Device Core | e200z7d |
| Program Memory Type | Flash |
| Program Memory Size | 2MB |
| RAM Size | 512KB |
| Number of Programmable I/Os | 16 |
| Core Architecture | e200 |
| Programmability | Yes |
| Number of Timers | 5 |
| Interface Type | CAN/Ethernet/I2C/SCI/SPI |
| CAN | 4 |
| I2C | 3 |
| SPI | 3 |
| Ethernet | 1 |
| UART | 0 |
| USART | 0 |
| USB | 0 |
| I2S | 0 |
| Max Operating Supply Voltage | 3.6|5.5V |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 125°C |
| ADC Channels | 34/34/34/34 |
| Number of ADCs | Quad |
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542310001 |
| Schedule B | 8542310000 |
| ECCN | 3A991.a.2 |
| Automotive | Yes |
| AEC Qualified | Yes |
| RoHS Versions | 2011/65/EU, 2015/863 |
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