PackageTFBGA
MountingSurface Mount
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Technical Specifications
NXP SSTUB32868ET/G,518 technical specifications.
General
Basic Package Type
Ball Grid Array
Package Family Name
BGA
Package/Case
TFBGA
Package Description
Thin Fine Pitch Ball Grid Array
Lead Shape
Ball
Pin Count
176
PCB
176
Package Length (mm)
15.1(Max)
Package Width (mm)
6.1(Max)
Package Height (mm)
0.8(Max)
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
5A992
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP SSTUB32868ET/G,518 Datasheet
Download the complete datasheet for NXP SSTUB32868ET/G,518 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.