The SSTVF16857DGV,118 is a 48-pin TSSOP lead-frame SMT shift register from NXP. It features a thin shrink small outline package with a gull-wing lead shape and a maximum seated plane height of 1.1mm. The device is designed for surface mount applications and is constructed from plastic. The SSTVF16857DGV,118 operates within a maximum package length of 9.8mm, width of 4.5mm, and height of 0.95mm. It meets the MO-153 Jedec standard.
PackageTSSOP
MountingSurface Mount
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Technical Specifications
NXP SSTVF16857DGV,118 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | TSSOP |
| Package Description | Thin Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 9.8(Max) |
| Package Width (mm) | 4.5(Max) |
| Package Height (mm) | 0.95(Max) |
| Seated Plane Height (mm) | 1.1(Max) |
| Pin Pitch (mm) | 0.4 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-153 |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP SSTVF16857DGV,118 Datasheet
Download the complete datasheet for NXP SSTVF16857DGV,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.