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Technical Specifications
NXP TDA3608TH/N3,512 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
HSOP
Package/Case
HSOP
Package Description
Heat Sinked Small Outline Package
Pin Count
20
PCB
20
Package Length (mm)
16(Max)
Package Width (mm)
11.1(Max)
Package Height (mm)
3.5(Max)
Seated Plane Height (mm)
3.5(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA3608TH/N3,512 Datasheet
Download the complete datasheet for NXP TDA3608TH/N3,512 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.