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Technical Specifications
NXP TDA8001A/C1 technical specifications.
General
Basic Package Type
Through Hole
Package Family Name
DIP
Package/Case
PDIP
Package Description
Plastic Dual In Line Package
Lead Shape
Through Hole
Pin Count
28
PCB
28
Package Length (mm)
36(Max)
Package Width (mm)
14.1(Max)
Package Height (mm)
4(Max)
Seated Plane Height (mm)
5.1(Max)
Pin Pitch (mm)
2.54
Package Material
Plastic
Mounting
Through Hole
Compliance
Cage Code
H1R01
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP TDA8001A/C1 Datasheet
Download the complete datasheet for NXP TDA8001A/C1 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.