NXP
TDA8004AT/C1,118
28-Pin Lead-Frame SMT SOP IC, Small Outline, Surface Mount, 18.1mm x 7.6mm x 2.45mm
The TDA8004AT/C1,118 is a 28-pin lead-frame SMT SOP IC with a small outline package, designed for surface mount applications. It measures 18.1mm in length, 7.6mm in width, and 2.45mm in height. The IC has a gull-wing lead shape and a pin pitch of 1.27mm. The package is made of plastic and is compliant with the Jedec MS-013 standard.
PackageSO
MountingSurface Mount
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Technical Specifications
NXP TDA8004AT/C1,118 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SO |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 18.1(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.45(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013 |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA8004AT/C1,118 Datasheet
Download the complete datasheet for NXP TDA8004AT/C1,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.