Smart card interface IC supporting EMV4.2, EMV 2000, GSM 11-11, and ISO 7816 standards. Features a maximum clock frequency of 10 MHz and operates with 3.3V or 5V supply voltages, with a maximum supply current of 315 mA and maximum power dissipation of 700 mW. Housed in a 48-pin LQFP package with gull-wing leads, measuring 7.1mm x 7.1mm x 1.45mm, designed for surface mounting. Operates across an industrial temperature range of -40°C to 85°C.
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP TDA8007BHL/C2,118 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
QFP
Package/Case
LQFP
Package Description
Low Profile Quad Flat Package
Lead Shape
Gull-wing
Pin Count
48
PCB
48
Package Length (mm)
7.1(Max)
Package Width (mm)
7.1(Max)
Package Height (mm)
1.45(Max)
Seated Plane Height (mm)
1.6(Max)
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-026BBC
Typical Operating Supply Voltage
3.3|5V
Maximum Supply Current
315mA
Maximum Clock Frequency
10MHz
Standard Supported
EMV4.2/EMV 2000/GSM 11-11/ISO 7816
Maximum Power Dissipation
700mW
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
6V
Min Operating Supply Voltage
2.7V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8007BHL/C2,118 Datasheet
Download the complete datasheet for NXP TDA8007BHL/C2,118 to view detailed technical specifications.
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