Smart card interface IC supporting EMV4.2, EMV 2000, GSM 11-11, and ISO 7816 standards. Features a maximum clock frequency of 10 MHz and operates with 3.3V or 5V supply voltages, with a maximum supply current of 315 mA and maximum power dissipation of 700 mW. Housed in a 48-pin LQFP package with gull-wing leads, measuring 7.1mm x 7.1mm x 1.45mm, designed for surface mounting. Operates across an industrial temperature range of -40°C to 85°C.
PackageLQFP
MountingSurface Mount
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Technical Specifications
NXP TDA8007BHL/C2,118 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | QFP |
| Package/Case | LQFP |
| Package Description | Low Profile Quad Flat Package |
| Lead Shape | Gull-wing |
| Pin Count | 48 |
| PCB | 48 |
| Package Length (mm) | 7.1(Max) |
| Package Width (mm) | 7.1(Max) |
| Package Height (mm) | 1.45(Max) |
| Seated Plane Height (mm) | 1.6(Max) |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-026BBC |
| Typical Operating Supply Voltage | 3.3|5V |
| Maximum Supply Current | 315mA |
| Maximum Clock Frequency | 10MHz |
| Standard Supported | EMV4.2/EMV 2000/GSM 11-11/ISO 7816 |
| Maximum Power Dissipation | 700mW |
| Min Operating Temperature | -40°C |
| Max Operating Temperature | 85°C |
| Max Operating Supply Voltage | 6V |
| Min Operating Supply Voltage | 2.7V |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA8007BHL/C2,118 Datasheet
Download the complete datasheet for NXP TDA8007BHL/C2,118 to view detailed technical specifications.
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