Smart card interface IC supporting EMV/ISO 7816/GSM11-11 standards. Features a maximum clock frequency of 3.2 MHz and operates with dual supply voltages of 3.3V or 5V, with a maximum supply voltage of 6.5V and minimum of 2.7V. Maximum power dissipation is 560 mW with a maximum supply current of 80 mA. Housed in a 28-pin SO package with gull-wing leads, this surface-mount component has a pin pitch of 1.27 mm and operates within a temperature range of -25°C to 85°C.
PackageSO
MountingSurface Mount
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Technical Specifications
NXP TDA8024AT/C1,112 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SO |
| Package Description | Small Outline IC |
| Lead Shape | Gull-wing |
| Pin Count | 28 |
| PCB | 28 |
| Package Length (mm) | 18.1(Max) |
| Package Width (mm) | 7.6(Max) |
| Package Height (mm) | 2.45(Max) |
| Seated Plane Height (mm) | 2.65(Max) |
| Pin Pitch (mm) | 1.27 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MS-013AE |
| Typical Operating Supply Voltage | 3.3|5V |
| Maximum Supply Current | 80mA |
| Maximum Clock Frequency | 3.2MHz |
| Standard Supported | EMV/ISO 7816/GSM11-11 |
| Maximum Power Dissipation | 560mW |
| Min Operating Temperature | -25°C |
| Max Operating Temperature | 85°C |
| Max Operating Supply Voltage | 6.5V |
| Min Operating Supply Voltage | 2.7V |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA8024AT/C1,112 Datasheet
Download the complete datasheet for NXP TDA8024AT/C1,112 to view detailed technical specifications.
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