Smart card interface IC supporting EMV/ISO 7816/GSM11-11 standards. Features a maximum clock frequency of 3.2 MHz and operates with dual supply voltages of 3.3V or 5V, with a maximum supply voltage of 6.5V and minimum of 2.7V. Maximum power dissipation is 560 mW with a maximum supply current of 80 mA. Housed in a 28-pin SO package with gull-wing leads, this surface-mount component has a pin pitch of 1.27 mm and operates within a temperature range of -25°C to 85°C.
PackageSO
MountingSurface Mount
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Technical Specifications
NXP TDA8024AT/C1,112 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
28
PCB
28
Package Length (mm)
18.1(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.45(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Jedec
MS-013AE
Typical Operating Supply Voltage
3.3|5V
Maximum Supply Current
80mA
Maximum Clock Frequency
3.2MHz
Standard Supported
EMV/ISO 7816/GSM11-11
Maximum Power Dissipation
560mW
Min Operating Temperature
-25°C
Max Operating Temperature
85°C
Max Operating Supply Voltage
6.5V
Min Operating Supply Voltage
2.7V
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8024AT/C1,112 Datasheet
Download the complete datasheet for NXP TDA8024AT/C1,112 to view detailed technical specifications.
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