Surface mount demodulator in a 40-pin HVQFN EP package, measuring 6x6x0.83mm with a 0.5mm pin pitch. This plastic, non-lead-frame SMT component features an exposed pad for thermal enhancement and operates within a 0°C to 70°C temperature range. Programmable functionality is supported with operating supply voltages ranging from 1.08V to 3.63V. Maximum power dissipation is 490mW, with a maximum supply current of 0.136A.
PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
NXP TDA8295HN/C1,518 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
40
PCB
40
Package Length (mm)
6
Package Width (mm)
6
Package Height (mm)
0.83
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220
Device Type
Demodulator
Min Operating Temperature
0°C
Max Operating Temperature
70°C
Programmability
Yes
Min Operating Supply Voltage
1.08|2.97V
Typical Operating Supply Voltage
1.2|3.3V
Max Operating Supply Voltage
1.32|3.63V
Maximum Power Dissipation
490mW
Maximum Supply Current
0.136A
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542390001
Schedule B
8542390000
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8295HN/C1,518 Datasheet
Download the complete datasheet for NXP TDA8295HN/C1,518 to view detailed technical specifications.
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