40-pin HVQFN EP surface mount demodulator with thermal enhancement and exposed pad. Features a 6mm x 6mm x 0.83mm plastic package with a 0.5mm pin pitch, suitable for PCB mounting. Operates with supply voltages from 1.08V to 3.63V, offering programmability. Maximum power dissipation is 490mW with a maximum supply current of 0.136A, operating between 0°C and 70°C.
PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
NXP TDA8295HN/C1,557 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | HVQFN EP |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 40 |
| PCB | 40 |
| Package Length (mm) | 6 |
| Package Width (mm) | 6 |
| Package Height (mm) | 0.83 |
| Seated Plane Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220 |
| Device Type | Demodulator |
| Min Operating Temperature | 0°C |
| Max Operating Temperature | 70°C |
| Programmability | Yes |
| Min Operating Supply Voltage | 1.08|2.97V |
| Typical Operating Supply Voltage | 1.2|3.3V |
| Max Operating Supply Voltage | 1.32|3.63V |
| Maximum Power Dissipation | 490mW |
| Maximum Supply Current | 0.136A |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA8295HN/C1,557 Datasheet
Download the complete datasheet for NXP TDA8295HN/C1,557 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.