40-pin HVQFN EP surface mount demodulator with thermal enhancement and exposed pad. Features a 6mm x 6mm x 0.83mm plastic package with a 0.5mm pin pitch. Operates from 1.08V to 3.63V with a maximum supply current of 0.179A and power dissipation of 631mW. Programmable device suitable for -20°C to 85°C operating temperatures.
PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
NXP TDA8295HN/C2,551 technical specifications.
General
Basic Package Type
Non-Lead-Frame SMT
Package Family Name
QFN
Package/Case
HVQFN EP
Package Description
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad
Lead Shape
No Lead
Pin Count
40
PCB
40
Package Length (mm)
6
Package Width (mm)
6
Package Height (mm)
0.83
Seated Plane Height (mm)
0.85
Pin Pitch (mm)
0.5
Package Material
Plastic
Mounting
Surface Mount
Jedec
MO-220
Device Type
Demodulator
Min Operating Temperature
-20°C
Max Operating Temperature
85°C
Programmability
Yes
Min Operating Supply Voltage
1.08|2.97V
Typical Operating Supply Voltage
1.2|3.3V
Max Operating Supply Voltage
1.32|3.63V
Maximum Power Dissipation
631mW
Maximum Supply Current
0.179A
Compliance
Cage Code
H1R01
EU RoHS
Yes
HTS Code
8542310001
Schedule B
8542310000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8295HN/C2,551 Datasheet
Download the complete datasheet for NXP TDA8295HN/C2,551 to view detailed technical specifications.
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