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Technical Specifications
NXP TDA8444P/N4,112 technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | PDIP |
| Package Description | Plastic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 16 |
| PCB | 16 |
| Package Length (mm) | 21.8(Max) |
| Package Width (mm) | 6.48(Max) |
| Package Height (mm) | 3.7(Max) |
| Seated Plane Height (mm) | 4.7(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Converter Type | General Purpose |
| Architecture | Current Steering |
| Resolution | 6bit |
| Digital Interface Type | Serial (I2C) |
| Output Type | Voltage |
| Number of DAC Channels | 8 |
| Voltage Reference | External |
| Min Operating Temperature | -20°C |
| Max Operating Temperature | 70°C |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA8444P/N4,112 Datasheet
Download the complete datasheet for NXP TDA8444P/N4,112 to view detailed technical specifications.
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