PackageHSOP
MountingSurface Mount
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Technical Specifications
NXP TDA8566TH/N2C,112 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
HSOP
Package/Case
HSOP
Package Description
Heat Sinked Small Outline Package
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
16(Max)
Package Width (mm)
11.1(Max)
Package Height (mm)
3.5(Max)
Seated Plane Height (mm)
3.5(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Function
Speaker
Amplifier Type
Class-B
Input Signal Type
Differential
Output Signal Type
Differential
Output Type
2-Channel Stereo
Maximum Output Current
10000mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
Yes
AEC Qualified
Yes
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8566TH/N2C,112 Datasheet
Download the complete datasheet for NXP TDA8566TH/N2C,112 to view detailed technical specifications.
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