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Technical Specifications
NXP TDA8589BJ/N3,112 technical specifications.
General
Package Family Name
DBSP
Package/Case
DBSP
Lead Shape
Through Hole
Pin Count
37
PCB
37
Tab
Tab
Package Length (mm)
42.2(Max)
Package Width (mm)
4.65(Max)
Package Height (mm)
15.9(Max)
Seated Plane Height (mm)
19
Mounting
Through Hole
Compliance
Cage Code
H1R01
EU RoHS
Yes with Exemption
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8589BJ/N3,112 Datasheet
Download the complete datasheet for NXP TDA8589BJ/N3,112 to view detailed technical specifications.
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