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Technical Specifications
NXP TDA8722T/C3 technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
SOP
Package/Case
SO
Package Description
Small Outline IC
Lead Shape
Gull-wing
Pin Count
20
PCB
20
Package Length (mm)
13(Max)
Package Width (mm)
7.6(Max)
Package Height (mm)
2.45(Max)
Seated Plane Height (mm)
2.65(Max)
Pin Pitch (mm)
1.27
Package Material
Plastic
Mounting
Surface Mount
Compliance
Cage Code
H1R01
EU RoHS
Yes
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2011/65/EU, 2015/863
Datasheet
NXP TDA8722T/C3 Datasheet
Download the complete datasheet for NXP TDA8722T/C3 to view detailed technical specifications.
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