plastic, heatsink small outline package; 24 leads; low stand-off height
PackageHSOP
MountingSurface Mount
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Technical Specifications
NXP TDA8954TH technical specifications.
General
Basic Package Type
Lead-Frame SMT
Package Family Name
HSOP
Package/Case
HSOP
Package Description
Heat Sinked Small Outline Package
Pin Count
24
PCB
24
Package Length (mm)
16(Max)
Package Width (mm)
11.1(Max)
Package Height (mm)
3.5(Max)
Seated Plane Height (mm)
3.5(Max)
Pin Pitch (mm)
1
Package Material
Plastic
Mounting
Surface Mount
Function
Speaker
Amplifier Type
Class-D
Input Signal Type
Differential
Output Signal Type
Differential|Single
Output Type
1-Channel Mono|2-Channel Stereo
Maximum Output Current
12000(Min)mA
Min Operating Temperature
-40°C
Max Operating Temperature
85°C
Compliance
Cage Code
H1R01
HTS Code
8542330001
Schedule B
8542330000
ECCN
EAR99
Automotive
No
AEC Qualified
No
PPAP
No
Radiation Hardening
No
RoHS Versions
2002/95/EC
Datasheet
NXP TDA8954TH Datasheet
Download the complete datasheet for NXP TDA8954TH to view detailed technical specifications.
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