The TDA9801/V1,112 is a 20-pin PDIP through hole modulator/demodulator IC from NXP. It features a plastic dual in line package with a maximum package length of 26.29mm, width of 6.4mm, and height of 3.2mm. The IC is designed for through hole mounting with a pin pitch of 2.54mm and is compliant with the MS-001 Jedec standard.
PackagePDIP
MountingThrough Hole
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Technical Specifications
NXP TDA9801/V1,112 technical specifications.
General
| Basic Package Type | Through Hole |
| Package Family Name | DIP |
| Package/Case | PDIP |
| Package Description | Plastic Dual In Line Package |
| Lead Shape | Through Hole |
| Pin Count | 20 |
| PCB | 20 |
| Package Length (mm) | 26.29(Max) |
| Package Width (mm) | 6.4(Max) |
| Package Height (mm) | 3.2(Max) |
| Seated Plane Height (mm) | 4.2(Max) |
| Pin Pitch (mm) | 2.54 |
| Package Material | Plastic |
| Mounting | Through Hole |
| Jedec | MS-001 |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| HTS Code | 8542390001 |
| Schedule B | 8542390000 |
| ECCN | EAR99 |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA9801/V1,112 Datasheet
Download the complete datasheet for NXP TDA9801/V1,112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.