The TDA9881HN/V2,118 is a specialized IC available in an HVQFN EP package with 32 pins. It is designed for surface mount applications and features a non-lead frame SMT package. The IC has a thermal enhanced very thin quad flat package with an exposed pad, measuring 5.1mm in length and 5.1mm in width, with a height of 0.85mm to 0.05mm maximum. It is constructed from plastic and has a pin pitch of 0.5mm. The IC is compliant with the MO-220VHHD-2 Jedec standard.
PackageHVQFN EP
MountingSurface Mount
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Technical Specifications
NXP TDA9881HN/V2,118 technical specifications.
General
| Basic Package Type | Non-Lead-Frame SMT |
| Package Family Name | QFN |
| Package/Case | HVQFN EP |
| Package Description | Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Lead Shape | No Lead |
| Pin Count | 32 |
| PCB | 32 |
| Package Length (mm) | 5.1(Max) |
| Package Width (mm) | 5.1(Max) |
| Package Height (mm) | 0.85 - 0.05(Max) |
| Seated Plane Height (mm) | 0.85 |
| Pin Pitch (mm) | 0.5 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-220VHHD-2 |
Compliance
| Cage Code | H1R01 |
| EU RoHS | No |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA9881HN/V2,118 Datasheet
Download the complete datasheet for NXP TDA9881HN/V2,118 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.