The TDA9884TS/V1,112 is a specialized IC from NXP, packaged in a 24-pin SSOP lead-frame SMT package. It has a maximum package length of 8.4mm, width of 5.4mm, and height of 1.8mm. The IC is designed for surface mount and has a seated plane height of 2mm. It is made of plastic and has a pin pitch of 0.65mm.
PackageSSOP
MountingSurface Mount
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Technical Specifications
NXP TDA9884TS/V1,112 technical specifications.
General
| Basic Package Type | Lead-Frame SMT |
| Package Family Name | SOP |
| Package/Case | SSOP |
| Package Description | Shrink Small Outline Package |
| Lead Shape | Gull-wing |
| Pin Count | 24 |
| PCB | 24 |
| Package Length (mm) | 8.4(Max) |
| Package Width (mm) | 5.4(Max) |
| Package Height (mm) | 1.8(Max) |
| Seated Plane Height (mm) | 2(Max) |
| Pin Pitch (mm) | 0.65 |
| Package Material | Plastic |
| Mounting | Surface Mount |
| Jedec | MO-150AG |
Compliance
| Cage Code | H1R01 |
| EU RoHS | Yes |
| Automotive | No |
| AEC Qualified | No |
| PPAP | No |
| Radiation Hardening | No |
| RoHS Versions | 2011/65/EU, 2015/863 |
Datasheet
NXP TDA9884TS/V1,112 Datasheet
Download the complete datasheet for NXP TDA9884TS/V1,112 to view detailed technical specifications.
This datasheet cannot be embedded due to technical restrictions.